SmartView NT

The SmartView NT is an automated bond alignment system offering a proprietary method for micron-level face-to-face wafer alignment. This advanced alignment technique is crucial for achieving the high precision needed in multiple wafer stacks for cutting-edge technologies. Ideal for applications like wafer stacking for 3D interconnects, wafer-level packaging, and high-volume MEMS devices, the SmartView NT ensures accuracy and efficiency in demanding production environments.

Features

• Suitable for automated and integrated EVG bonding systems (EVG560®, GEMINI®) in 200 mm and 300 mm configurations
• Wafer stacking for 3D interconnect, wafer-level packaging and high-volume MEMS devices
• Universal bond aligner (face-to-face-, backside-, infrared- and transparent alignment)
• No Z-axis motion and no refocusing required
• Windows® based user interface
• Bond pairs are aligned and clamped prior to loading into the bond chamber
• Manual or fully automated configurations (e.g. integration with GEMINI®)
• Options
• Can be combined with the EVG®500 series wafer bonding systems, EVG®300 series cleaning systems and EVG®810 LT plasma systems for a fully automated wafer-to-wafer alignment operation with cassette-to-cassette operation